Capabilities

New Product Introduction

  • BOM Analysis, Machine Programming Interface, and Process Documentation via Aegis NPI Software
  • Business Management Systems utilizing Intuitive ERP
  • Quick-Turn Prototype
  • 3 to 5 day Process Time
  • Dedicated NPI Cell
  • Design Feedback Mechanism

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SMT Technologies

  • Multiple High Speed Production Lines
  • Single and Double Sided Boards
  • Single-layer rugged/heavy construction
  • Multi-layer complex high density fine pitched components including BGA, uBGA, connectors and 0201placement
  • Flex circuit technologies
  • RoHS compliant manufacturing

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Assembly Process Technologies

  • Multiple board finishes including HASL, nickel-gold, and immersion tin
  • PB Free, No Clean, RMA, and Water Soluble Chemistries
  • Wave Solder w/Chip Wave
  • Automated Thru-Hole Insertion; Radial, Axial, Dip
  • Austin American Micro-Jet Aqueous Cleaning System
  • Hand Assembly via Customized Work Cells and Progressive Flow Lines
  • Electro-Mechanical Assembly with Dedicated Customer Product Cells
  • Cable and Harness Interconnect from 8ga to 30ga Wire with Automated Laser and Mechanical Wire Stripping Terminations
  • Selective Solder Automation Equipment

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Test

  • Development Services
    • We can provide test station design to support manufacturing processes with in-circuit and functional testing.
  • Flying Probe Test
    • Four independent test probes simultaneously apply the stimuli and perform the measurements needed to fully test a printed circuit board. Active and passive analog tests, signature analysis on each test point, boundary scan, and component presence and orientation and inspection are performed. This test, similar to in-circuit without the use of a fixture, is ideal for low-volume high-mix production and for first-piece and prototyping to prove out a design. This method of testing saves our customers time and money by improving throughput for new product introductions and eliminating the need for costly replacement fixtures when assemblies are redesigned.
  • Functional Test
    • Functionality of the final product can be tested to our customer's specifications using customer-furnished test equipment or special test equipment and specifications developed by Saunders Electronics.
  • X-Ray Imaging
    • Quickly and automatically scans a printed circuit board assembly, analyzes the cross-sectional X-ray images and identifies the exact location and characteristics of solder joints, ensuring the quality of BGA placements and reducing costly and time consuming component removal and replacement.

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